Semiconductor device measuring socket capable of adjusting contact positions, and semiconductor device manufacturing method using the same

ABSTRACT

In a semiconductor device measuring socket, contact positions are adjustable by employing spacers. The semiconductor device measuring socket comprising: a wiring pattern board on which a test circuit is formed; a substantially S-shaped contact for electrically connecting the wiring pattern board to external leads arrayed on a semiconductor device; a supporting member for elastically supporting the contact under tiltable condition; a socket main body for storing thereinto the contact and the supporting member and for mounting the wiring pattern board on a lower portion of the socket main body; and adjusting means for adjusting a tilting amount of the contact with respect to the socket main body. When the wiring pattern board is mounted on the socket main body, a lower end portion of the contact which is projected from the lower surface of the socket main body is depressed by the wiring pattern board to thereby tilt the contact, whereby a contact position between the external lead and the contact is determined.

BACKGROUND OF THE INVENTION

[0001] The present invention generally relates to a semiconductor devicemeasuring socket capable of adjusting CONTACT positions, and asemiconductor device manufacturing method using this socket. Morespecifically, the present invention is directed to such a semiconductordevice measuring socket having a substantially S-shaped contact, andusable in electrically measuring of a high frequency surface mountingtype plastic package, and also to a semiconductor device manufacturingmethod, while using this semiconductor device measuring socket.

[0002] Conventionally, when electrical characteristics of semiconductorplastic package components employed in high frequency circuits aremeasured, measuring sockets equipped with substantially S-shapedcontacts are utilized. These conventional measuring sockets are capableof shortening distances defined from external leads of semiconductordevices up to wiring pattern boards (DUT boards) on which test circuitsare formed.

[0003]FIG. 1 schematically represents a major structural portion of thissort of one conventional semiconductor device measuring socket indicatedby reference numeral 1. As represented in FIG. 2, substantially S-shapedcontacts 3 are arranged in a space 2 a formed inside a socket main body2 in correspondence with external leads 11 of a semiconductor device 10which constitutes a surface mounting type semiconductor packagecomponent. The substantially S-shaped contacts 3 are manufactured byplating gold on copper. The external leads 11 are electrically connectedto a wiring pattern board 5 via these contacts 3. Both the socket mainbody 2 and the wiring pattern board 5 are detachably supported by a base6 by employing fastening means such as a bolt (not shown). A supportingmember 4 made of rubber is inserted into an inner peripheral portion(inner circumference) of each curved portion of the contacts 3. Bothends of this supporting member 4 are fixed on the socket main body 2.When the wiring pattern board 5 is mounted on the lower portion of thesocket main body 2, since the lower end portions of the contacts 3 whichare projected from the lower end surface of the socket main body 2 aredepressed against the wiring pattern board 5, the contacts are inclinedto the inside of the socket main body 2 against elastic force of thesupporting member 4, as indicated in FIG. 3. At this time, the contactcondition between the contacts 3 and the land portion of the wiringpattern board 5 can be maintained by utilizing recovery force of thesupporting member 4.

[0004] Before the wiring pattern board 5 is mounted on the lower portionof the socket main body 2, an interval between contact positions C and Cof the contacts 3 and 3 located opposite to each other with respect tothe external leads 11 is equal to L₀ (see FIG. 4A), whereas after thewiring pattern board 5 is mounted, an interval between these contactpositions C and C is equal to L (<L₀) (see FIG. 4B). In this case, thecontact positions C and C correspond to vertexes of these contacts 3 and3. This interval L is previously set in correspondence with an intervalbetween a right lead array and a left lead array of the semiconductordevice 10. It should be understood that the supporting member 4 is notshown in FIG. 4A and FIG. 4B.

[0005] The conventional semiconductor device measuring socket 1 havingthe above-described structure owns such a problem that the contactpositions C could not be obtained under better condition when theright/left lead widths (namely, widths among right lead array and leftlead array) of the semiconductor device 10 are fluctuated. That is, inorder establish the better contact conditions between the external leads11 whose tip portions are bent along the horizontal direction, and thecontacts 3 whose the peripheral portions are shaped as an arc shape, thevertexes of the contacts 3 are required to be set as the contactpositions C. Since forming of these contact positions C is limited onlyto a very narrow range, such a better contact condition cannot beestablished with respect to the semiconductor device having the leadwidth which cannot be fixedly fitted to the interval L of the contactpositions C. This interval L is temporarily determined when thesemiconductor device is mounted on the wiring pattern substrate 5. As aresult, the correct measurement could not be carried out.

[0006] There are differences in the fluctuations (50 μm to 300 μm) ofthis lead width, depending upon the manufacturing lot. As a consequence,the contact positions C which have been fitted before the measurement iscommenced are required to be again adjusted. However, in theconventional semiconductor device measuring socket 1, this contactposition adjustment could not be carried out. As a consequence, thesockets which can be fitted to the respective fluctuations must bemanufactured, resulting in higher manufacturing cost. In such a casethat one socket whose contact positions are not correctly fitted tocontacts of a semiconductor device under measurement is directly used,measurements must be repeated several times, resulting in large temporalloss.

[0007] SUMMARY OF THE INVENTION

[0008] The present invention has been made to solve the above-explainedproblems, and therefore, has an object to provide a semiconductor devicemeasuring socket capable of adjusting contact positions thereof, andalso a semiconductor device manufacturing method, with employment ofsuch a semiconductor device measuring socket.

[0009] To achieve the object, a semiconductor device measuring socket,according to an aspect of the present invention, is featured bycomprising:

[0010] a wiring pattern board on which a test circuit is formed;

[0011] a substantially S-shaped contact for electrically connecting thewiring pattern board to external leads arrayed on a semiconductordevice;

[0012] a supporting member for elastically supporting the contact undertiltable condition;

[0013] a socket main body for storing thereinto the contact and thesupporting member and for mounting the wiring pattern board on a lowerportion of the socket main body; and

[0014] adjusting means for adjusting a tilting amount of the contactwith respect to the socket main body;

[0015] wherein:

[0016] when the wiring pattern board is mounted on the socket main body,a lower end portion of the contact which is projected from the lowersurface of the socket main body is depressed by the wiring pattern boardto thereby tilt the contact, whereby a contact position between theexternal lead and the contact is determined.

[0017] Furthermore, a semiconductor device manufacturing method,according to another aspect of the present invention, is featured bysuch a method for manufacturing a semiconductor device, comprising astep for measuring the semiconductor device by employing a semiconductordevice measuring socket having: a wiring pattern board on which a testcircuit is formed; a substantially S-shaped contact for electricallyconnecting the wiring pattern board to external leads arrayed on asemiconductor device; a supporting member for elastically supporting thecontact under tiltable condition; a socket main body for storingthereinto the contact and the supporting member and for mounting thewiring pattern board on a lower portion of the socket main body;wherein:

[0018] a step for adjusting a tilting amount of the contact by employingadjusting means provided on the semiconductor device measuring socket isexecuted before the semiconductor device measuring step in such a casethat when the wiring pattern board is mounted on the socket main body, alower end portion of the contact which is projected from the lowersurface of the socket main body is depressed by the wiring pattern boardto thereby tilt the contact, whereby a contact position between theexternal lead and the contact is determined.

[0019] As previously described, in accordance with the presentinvention, the contact positions with respect to the socket main body,which are changed before/after mounting the wiring pattern board, aredetermined based on the tilting amount of the contacts when the wiringpattern board is mounted on the socket main body. Therefore, theabove-described adjusting means capable of adjusting the tilting amountof the contacts is newly employed so as to correctly adjust the contactpositions.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] For a better understanding of the present invention, reference ismade of a detailed description to be read in conjunction with theaccompanying drawings, in which:

[0021]FIG. 1 is a cross-sectional view for schematically showing themajor portion of the conventional semiconductor device measuring socket;

[0022]FIG. 2 is a perspective view for representing a positionalrelationship between the conventional socket and the semiconductordevice;

[0023]FIG. 3 is a cross-sectional view for schematically showing theeffects of the contact in the conventional socket;

[0024] FIGS. 4A and FIG. 4B schematically illustrate the effects of theconventional socket before/after the wiring pattern board is mounted tothe conventional socket;

[0025]FIG. 5 is a cross-sectional view for schematically showing a majorportion of a semiconductor device measuring socket according to anembodiment of the present invention;

[0026]FIG. 6 is a plan view for indicating a spacer employed in thesemiconductor device measuring socket of FIG. 5;

[0027]FIG. 7 is a side view for schematically indicating effects of thesemiconductor device measuring socket of FIG. 5;

[0028]FIG. 8A is an outer view of the conventional contact;

[0029]FIG. 8B is an outer view of a contact employed in thesemiconductor device measuring socket of FIG. 5; and

[0030]FIG. 9A and FIG. 9B are sectional views for indicating a majorportion of an adjusting means according to a modification of the presentinvention when the adjusting means is not operated, and under operation,respectively.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] Referring now to drawing, various preferred embodiments of thepresent invention will be described in detail.

[0032]FIG. 5 schematically represents a major portion of a semiconductordevice measuring socket according to an embodiment of the presentinvention. This semiconductor device measuring socket is indicated byreference numeral 21. It should be noted that the same referencenumerals shown in FIG. 1 will be employed as those for denoting thesame, or similar components of the semiconductor device measuring deviceshown in FIG. 5, and therefore, detailed explanations thereof areomitted. In accordance with this embodiment, a pair of spacer 27A andspacer 27B indicated in FIG. 6 are interposed between a socket main body2 and a wiring pattern board 5. Each of these spacers 27A and 27B is athin metal plate made of stainless steel, and these spacers 27A and 27Bhave the same thickness. The paired spacers 27A and 27B are fixed viabolt mounting holes h onto the socket main body 2 and the wiring patternboard 5. It should also be noted that these spacers 27A and 27B areemployed as one pair of members in this embodiment. Alternatively, thesespacers may be apparently substituted by a single member.

[0033] In other words, in accordance with this embodiment, in the casethat the contacts 3 are forcibly pushed into the socket main body 2 whenthe wiring pattern board 5 is mounted on the socket main body 2, thepushing amount is adjustable by these spacers 27A and 27B. These spacers27A and 27B are interposed between the socket main body 2 and the wiringpattern board 5 as an adjusting means for adjusting a tilting amount ofthe contact 3. For instance, as represented in FIG. 7, the tiltingamount of the contacts 3 is adjusted when there is no spacer, and alsowhen two sets of spacers having different thicknesses are employed. Itis assumed that these two spacers correspond to a first spacer having athickness of 50 μm and a second spacer having a thickness of 100 μm. Asapparent from FIG. 7, distances L_(A), L_(B), and L_(C) defined from avertical bisector (will be referred as a reference line O) made betweenthe contacts located opposite to each other, up to each of contactpositions C_(A), C_(B), and C_(C) are varied. In this case, a dot/dashline represents such a case that the second spacer is employed, a solidline indicates such a case that the first spacer is employed, and atwo-dot/dash line indicates such a case that no spacer is employed.

[0034] As previously explained, a desirable contact position can beobtained by adjusting the thicknesses of the spacers, or by interposing,or not interposing the spacers between the socket main body 2 and thewiring pattern board 5. As a result, the contact positions can be freelyadjusted in fitting of the lead widths of the semiconductor device 10.Also, such a measuring socket is no longer manufactured in accordancewith the fluctuations in the lead widths of the semiconductor advice 10.Moreover, a desirable measuring socket 21 can be readily obtained bysimply adding the spacers 27A and 27B to the conventional measuringsocket. In addition, the spacer 27A and the spacer 27B are merelyinterposed between the detachable socket main body 2 and the wiringpattern board 5 by using the fasten means such as bolts. Therefore,these spacers 27A and 27B can be easily mounted and/or replaced by otherspacers. Furthermore, it is not require to manufacture such a member forsupporting these spacers 27A and 27B.

[0035] Alternatively, to expand the adjusting range of the contactpositions by these spacers 27A and 27B, the below-mentioned contact 23may be employed, so that the adjusting effects of the contact positionsby the spacers 27A and 27B may be emphasized. This contact 23 is such acontact that a projection portion 23 a (see FIG. 8B) projected to theside of the wiring pattern board 5 is formed at an outer peripheralportion of a lower curved portion of a conventional contact (namely,outer shape of actual product) 3 indicated in FIG. 8A. In other words,as previously explained, the adjusting effect of the contact positionsby the spacers 27A and 27B is adjustable by the pushing amount of thecontact 3 projected from the lower surface of the socket main body 2when the wiring pattern board 5 is mounted. As a result, the maximumthicknesses of these spacers 27A and 27B are limited by the projectionamount of the contact 3 from this socket main body 2. Therefore, if theprojection portion 23 a is formed to increase the projection amount ofthe above-described contact 3, then the above-described problem can besolved. As a consequence, the adjustable range of the contact positionscan be expanded.

[0036] While the various preferred embodiments have been described indetail, the present invention is not limited thereto, but may bemodified, changed, or substituted without departing from the technicalscope and spirit of the present invention.

[0037] For example, in the above-explained embodiment, both the spacers27A and 27B are interposed between the socket main body 2 and the wiringpattern board 5 as the adjusting means for adjusting the tilting amountof the contact 3. The present invention is not limited thereto, but maybe modified. Alternatively, as indicated in FIG. 9A and FIG. 9B,adjusting means 30 capable of adjusting desirable spaces between thesocket main body 2 and the wiring pattern board 5 may be provided atfour corners of the socket main body 2. The adjusting means 30 isconstituted by an abutting portion 30 a which abuts against the uppersurface of the wiring pattern board 5, and an abutting portion 30 bwhich is integrally fixed on this abutting portion 30 a. Under such acondition as shown in FIG. 9A, the bolt portion 30 b is pivotally movedfrom the upper surface side of the socket main body 2, and the socketmain body 2 is pushed up by a preselected amount by this abuttingportion 30 a. Thus, a desirable space may be formed between the socketmain body 2 and the wiring pattern body 5, as represented in FIG. 9B.With employment of this alternative structure, it is possible to achievea similar effect to that of the above-explained embodiment. The tiltingamount of the contact 3 is adjusted so as to thereby fine-adjust thecontact positions.

[0038] Also, in the above-explained embodiment, the bolt is employed asthe fastening means capable of detachably mounting both the socket mainbody 2 and the wiring pattern board 5. Alternatively, when the socketmain body 2 is coupled to one end portion of the wiring pattern board 5by employing a hinge and the other end portion thereof is fixed by aclamping member, the spacers may be easily mounted and/or replaced.

[0039] As previously described in detail, in accordance with thesemiconductor device measuring socket of the present invention, sincethe adjusting means is employed which is capable of adjusting thetilting amount of the contacts when the wiring pattern board is mountedon the socket main body, the contact positions can be adjusted incorrespondence with the right/left lead widths of the semiconductordevice. As a consequence, such a semiconductor device havingfluctuations in the lead widths can be correctly measured by using thissemiconductor device measuring socket.

What is claimed is:
 1. A semiconductor device measuring socketcomprising: a wiring pattern board on which a test circuit is formed; asubstantially S-shaped contact for electrically connecting said wiringpattern board to external leads arrayed on a semiconductor device; asupporting member for elastically supporting said contact under tiltablecondition; a socket main body for storing thereinto said contact andsaid supporting member and for mounting said wiring pattern board on alower portion of said socket main body; and adjusting means foradjusting a tilting amount of said contact with respect to said socketmain body; wherein: when said wiring pattern board is mounted on saidsocket main body, a lower end portion of said contact which is projectedfrom the lower surface of said socket main body is depressed by saidwiring pattern board to thereby tilt said contact, whereby a contactposition between said external lead and said contact is determined.
 2. Asemiconductor device measuring socket as claimed in claim 1 wherein:said adjusting means is provided between said socket main body and saidwiring pattern board, and is made of a thin film spacer having athickness smaller than a projection amount of said contact which isprojected from the lower surface of said socket main body.
 3. Asemiconductor device measuring socket as claimed in claim 1 , furthercomprising: fastening means for detachably fastening said wiring patternboard to said socket main body.
 4. A semiconductor device measuringsocket as claimed in claim 1 wherein: a projection portion is formed onan outer peripheral region of a lower curved portion of said contact soas to additionally emphasize the adjusting effect achieved by saidadjusting means, said projection portion projecting toward said wiringpattern board.
 5. A method for manufacturing a semiconductor device,comprising a step for measuring said semiconductor device by employing asemiconductor device measuring socket having: a wiring pattern board onwhich a test circuit is formed; a substantially S-shaped contact forelectrically connecting said wiring pattern board to external leadsarrayed on a semiconductor device; a supporting member for elasticallysupporting said contact under tiltable condition; a socket main body forstoring thereinto said contact and said supporting member and formounting said wiring pattern board on a lower portion of said socketmain body; wherein: a step for adjusting a tilting amount of saidcontact by employing adjusting means provided on said semiconductordevice measuring socket is executed before said semiconductor devicemeasuring step in such a case that when said wiring pattern board ismounted on said socket main body, a lower end portion of said contactwhich is projected from the lower surface of said socket main body isdepressed by said wiring pattern board to thereby tilt said contact,whereby a contact position between said external lead and said contactis determined.
 6. A semiconductor device manufacturing method as claimedin claim 5 wherein: said adjusting means is provided between said socketmain body and said wiring pattern board, and is made of a thin filmspacer having a thickness smaller than a projection amount of saidcontact which is projected from the lower surface of said socket mainbody.
 7. A semiconductor device manufacturing method as claimed in claim5 , wherein: fastening means for detachably fastening said wiringpattern board to said socket main body is further provided.
 8. Asemiconductor device manufacturing method as claimed in claim 5 wherein:a projection portion is formed on an outer peripheral region of a lowercurved portion of said contact so as to additionally emphasize theadjusting effect achieved by said adjusting means, said projectionportion projecting toward said wiring pattern board.